Thermal Characteristics

Table 1.
Standard Operating Conditions (unless otherwise stated)
Param No. Sym. Characteristic Typ. Units Conditions
TH01 θJA Thermal Resistance Junction to Ambient 60 °C/W 28-pin SPDIP package
80 °C/W 28-pin SOIC package
90 °C/W 28-pin SSOP package
27.5 °C/W 28-pin UQFN 4x4 mm package
27.5 °C/W 28-pin QFN 6x6mm package
TH03 TJMAX Maximum Junction Temperature 150 °C  
Note:
  1. 1.See "Absolute Maximum Ratings" for total power dissipation.
Parent topic: DC Characteristics